India's semiconductor push gets major boost with $3.3 bn Odisha deal with Intel, 3D Glass Solutions for new substrate project

Odisha, Intel, and 3D Glass Solutions are building a $3.3 billion chip facility in India. This new plant will make advanced packaging glass core substrates. Officials said "the facility would manufacture advanced semiconductor components," boosting India's tech goals. This big investment shows growing trust in India's chip plans.